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AMD’s high-performance motherboard chipsets might be built out of chiplets

3 years ago
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Together with rumours that AMD’s Zen 4 will launch completely supporting DDR5, motherboard producers have additionally mentioned that AMD is shifting over to a chiplet design for its next-gen motherboards chips. AMD famously moved over to a chiplet design with its Zen 2 structure, the place it positioned 7nm CPU chiplets alongside a 14nm I/O hub die, however a dual-chiplet motherboard chipset is a unique beast totally.

AMD works with ASMedia to design its motherboard chipsets, and it seems that it’s going to solely be the top-end X670 chipset which is able to use the dual-chiplet design. Apparently, each chiplets are similar (in line with Tom’s {Hardware}), however by doubling them up the X670 can supply twice the throughput and connectivity of the single-chip designs used for the B650. The chiplet dies themselves will probably be produced utilizing TSMC’s 6nm manufacturing course of.

The only-chip implementation offers eight lanes of PCIe 4.0 connectivity, 4 of that are for PCIe 4.0 storage, with the remaining cut up between SATA drives and USB ports. The X670 will presumably double this as much as 16 lanes, massively bolstering the connectivity of the platform, and making it the platform of selection for followers of great storage. 

As already talked about the AM5 platform will assist DDR5 reminiscence and likewise ushers in assist for PCIe 5.0 for AMD, one thing that Intel’s Alder Lake already helps. The following query is after we’ll see PCIe 5.0 graphics playing cards, and it might effectively be AMD that is first to that exact get together, as rumours are Nvidia is sticking with PCIe 4.0 for its next-gen “Ada” graphics playing cards. 

Zen 4 and the accompanying shift to AM5 are as a consequence of launch later this 12 months. 



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